PCB Design MCQs

PCB Design MCQs

Our team has conducted extensive research to compile a set of PCB Design MCQs. We encourage you to test your PCB Design knowledge by answering these 60+ multiple-choice questions provided below.
Simply scroll down to begin!

1: Which of the following is not a film used in PCB design?

A.   A copper film

B.   A polyester film

C.   A photographic glass

D.   A tri-acetate film

2: Which one of the following is not a plating technique?

A.   Immersion plating

B.   Electroless plating

C.   Hard plating

D.   Electroplating

3: The analog and the digital circuit on the same PCB should have _____.

A.   common ground conductor networks

B.   independent ground conductor networks

C.   no ground conductor network

D.   None of the above

4: When two transmission lines are placed close to each other, they are said to be coupled. This coupling can be used to built

A.   band pass filters

B.   band elimination filters

C.   directional couplers

D.   All of the above

5: Etch back is a technique by which ______.

A.   epoxy smear is removed and the exposed glass fibers prepared for copper deposition

B.   epoxy smear is deposited and the exposed glass fibers prepared for copper removal

C.   etchants are removed again

D.   None of the above

6: Parasitic effects influence the working of a PCB.

A.   true

B.   false

C.   sometimes true and sometimes false

7: In the layout approach, a 'Puppet' is used for_____.

A.   a diode

B.   a transistor

C.   an IC

D.   any commonly used electronic component

8: For TTL , we require a wave impedance of_____.

A.   50-100ohm

B.   100-150ohm

C.   150-200ohm

D.   200-250ohm

9: Large values of wave impedance call for _____.

A.   broader signal conductors

B.   thin signal conductors

C.   both a and b

10: Screen printing is used in _____.

A.   photo printing

B.   screen printing

C.   hand printing

D.   All of the above

11: Which of the following is not a machine cleaning process for boards?

A.   Sanding

B.   Water rinse

C.   Wet brushing

D.   Scrubbing

12: Which of the following is a design constraint for the design of the flexible PCBs?

A.   Current carrying capacity of the conductors

B.   Bending

C.   Contours

D.   All of the above

13: Self soldering or soldering generally implies that the joining process occurs at temperatures below

A.   100°c

B.   200°c

C.   350°c

D.   450°c

14: What is hot air leveling used for?

A.   Etching

B.   PCB finishing

C.   PCB layout

D.   PCB artwork

15: A conductor in a printed circuit should be considered a transmission line if its length l (in meters) is

A.   l > Tr/100 nsec ( Tr- rise time of pulse)

B.   l > 2Tr/100 nsec

C.   l > Tr/200 nsec

D.   l > 2Tr/50 nsec

16: Which of the following is not a physical characteristic of a copper clad laminate?

A.   Flame resistance

B.   Water absorption

C.   Flexural strength

D.   Color

17: In fast signal or high – speed logic circuits , the conductors are considered to be _____.

A.   impedances

B.   transmission lines

C.   capacitors

D.   inductors

18: Copper plating is done in multilayer boards to _____.

A.   remove etchants

B.   remove excess copper

C.   withstand thermal shock due to soldering

D.   clean a PCB with chemicals

19: The dielectric constant of any material is also referred to as _____.

A.   permeability

B.   permittivity

C.   proximity

D.   resistivity

20: Which of the following techniques is used in mass soldering?

A.   Dip soldering

B.   Drag soldering

C.   Wave soldering

D.   All of the above

21: Which of the following is a technique for the generation of the circuit pattern on metal core boards?

A.   Substance additive processing

B.   Additive processing with catalytic adhesive

C.   Semi-additive processing

D.   Both a and b

22: By which material is the typical resin/filler laminate of ordinary PCBs replaced in metal core boards?

A.   Sheet metal covered with insulation material

B.   Cardboard

C.   Foil with insulation

D.   None of the above

23: Which of the following is not a solder alloy?

A.   Tin lead

B.   Tin antimony

C.   Tin silver

D.   Iron lead

24: Which of the following is a category of dry film resists?

A.   Solvent developing dry film resists

B.   Liquid developing dry film resists

C.   Hand developing dry film resists

D.   All of the above

25: For the etching process, the temperature should preferably be around

A.   30°C

B.   10°C

C.   45°C

D.   100°C

26: The volume resistivity of a laminate is given by

A.   R*A / l R- resistance measured

B.   R*l / A A-area of gourde electrode (cm2)

C.   A*l / R l-thickness of sample(cm)

D.   R / A*l

27: A standard hole(0.8mm) in a PCB design is represented by which symbol.

A.   О

B.   €

C.   Ө

D.   β

28: The biggest problem associated with striplines and microstrip lines is the

A.   low attenuation per unit length

B.   high attenuation per unit length

C.   low impedance per unit length

D.   high impedance per unit length

29: Ferric chloride is used in PCB designing as a/an _____.

A.   resist

B.   etchant

C.   board cleaner

D.   a soldering material

30: In which of the following ways can the required quantity of heat for the melting of the solder be supplied?

A.   Iron soldering

B.   Hot gas soldering

C.   Radiant heat soldering

D.   All of the above

31: Which of the following is a base material used in the manufacturing of flexible PCBs?

A.   Epoxy resin

B.   Polyester foil

C.   Teflon foil

D.   All of the above

32: Which of the following is not a basic ingredient of a copper clad laminate?

A.   Filler

B.   Resin

C.   Silver foil

D.   Copper foil

33: Ultra thin copper foil has a range of thickness varying from

A.   5-10cm

B.   5-10mm

C.   5-10um

D.   5-10nm

34: Current spikes in TTL circuit boards can be eliminated by which technique.

A.   removing the TTL circuit

B.   replacing transistors with diodes

C.   using a ground line

D.   All of the above

35: Which of the following tests is done for quality control for multilayer boards?

A.   Electrical and metallographic test

B.   Continuity between layers test

C.   Insulation resistance between layers test

D.   All of the above

36: The skin-effect losses are sometimes also called

A.   semiconductor losses

B.   conductor losses

C.   insulator losses

D.   None of the above

37: By which material is the transfer of the conductor pattern from the film master on to the copper clad base material done?

A.   Photo printing

B.   Hand printing

C.   Screen printing

D.   Both a and c

38: Removing the resists from the board in photo printing is called

A.   Post backing

B.   stripping

C.   touch up

D.   dyeing

39: Which size of rack is used as a standard rack in PCB design?

A.   18"

B.   19"

C.   20"

D.   21"

40: The microstrip line is derived from a _____.

A.   conductor on the ground

B.   conductor below the ground

C.   conductor above the ground

D.   None of the above

41: Crosstalk is much less dangerous in which of the following.

A.   ECL-ICs

B.   TTL-ICs

C.   RTL-ICs

D.   CMOS -ICs

42: hich of the following can be called multilayer construction?

A.   Clearance holes

B.   Plated through holes

C.   Fused tubelets or eyelets

D.   All of the above

43: On a PCB, the low power part and the high power part have to be spread sufficiently to avoid _____.

A.   capacitive and inductive coupling between power circuits

B.   crosstalk

C.   only inductive coupling

D.   only capacitive coupling

44: To overcome the motorboating effect, we must _____.

A.   do decoupling of power supply conductors with sufficiently large capacitors

B.   do decoupling of power supply conductors with small capacitors

C.   not to do any decoupling

45: If a ground line is kept close to a signal line, crosstalk would be _____.

A.   high

B.   low

C.   same

46: Which of the following is a type of soldering fluxes?

A.   Corrosive fluxes

B.   Intermediate fluxes

C.   Non-corrosive fluxes

D.   All of the above

47: Under which of the following conditions is a multilayers board used?

A.   Where the overall PCB dimensions and interconnections are not feasible on a double-sided PCB

B.   Where reduction in electronic equipment weight and volume is the prime concern

C.   Where decoupling and shielding of the interconnections is important

D.   All of the above

48: Fabrication of PCBs for microwave use requires

A.   VSWR > 1

B.   VSWR < 1

C.   VSWR exactly 1

D.   VSWR equal to zero

49: The biggest disadvantage of flexible PCBs is that

A.   they can not be used for low frequency applications

B.   they are not suitable for high frequency applications

C.   they can be used only in military applications

D.   they can used only in aerospace applications

50: How much copper surface is reserved on multilayer boards for the solderability test?

A.   20×70 mm

B.   10×50 mm

C.   20×70 cm

D.   10×50 cm