Try to answer these 200+ Microprocessor MCQs and check your understanding of the Microprocessor subject.
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A. Scanned keyboard special error mode
B. Scanned keyboard with N-key rollover
C. Scanned keyboard mode with 2 key lockout
D. Sensor matrix mode
A. More number of CPUs can be added
B. System structure is modular
C. More fault-tolerant and suitable for parallel applications
D. All of the mentioned
A. Storage of individual instructions
B. Temporary storage for the data
C. Storing common instructions or data for all processors
D. All of the mentioned
A. Register operand mode
B. Immediate operand mode
C. Register and immediate operand mode
D. None of the mentioned
A. First INTA (active low) pulse from 80286
B. Second INTA (active low) pulse from 80286
C. Third INTA (active low) pulse from 80286
D. None of the mentioned
A. Restricted use of segments
B. Restricted accesses to segments
C. Privileged instructions or operations
D. None of the mentioned
A. LEA
B. LDS
C. LES
D. LAHF
A. Programs with more than one segment for data and code
B. Programs with FAR subroutines each of size upto 64KB
C. Programs with more than one segment for stack
D. All of the mentioned
A. Interrupt handling ability
B. Interrupt processing ability
C. Multiple interrupt processing ability
D. Multiple interrupt executing ability
A. Number of internal teeth on a rotor
B. Number of internal teeth on a stator
C. Number of internal teeth on a rotor and stator
D. Number of external teeth on a stator
A. Operand field
B. Operation code field
C. Operation code field & operand field
D. None of the mentioned
A. Sequential control flow instructions
B. Control transfer instructions
C. Sequential control flow & control transfer instructions
D. None of the mentioned
A. Intrasegment direct addressing mode
B. Intrasegment indirect addressing mode
C. Intrasegment direct and indirect addressing mode
D. Intersegment direct addressing mode
A. Incremented by 1
B. Decremented by 1
C. Incremented by 2
D. Decremented by 2
A. PUSH
B. POP
C. PUSHF
D. POPF
A. Device
B. Chip
C. Board
D. Wafer Fab
A. A semiconductor foundry
B. A foundry
C. A PCB fab
D. A fab house
E. A semiconductor fabrication plant
A. PCB photolithography
B. Computer-aided design
C. Photolithography
D. VLSI Very Large Scale Integration
E. Substrate lithography
A. A type of computer architecture
B. A technique used in digital signal processing to reduce noise and interference
C. The process of placing hundreds of thousands (between 100,000 and one million) of electronic components on a single chip
D. An approach to computer architecture that uses a large number of interconnected microprocessors
E. The size of a chip that can process large amounts of data
A. Etching
B. Printing
C. Photography
D. Lithography
E. Screen printing
A. X-Ray Light
B. Ultraviolet Light
C. Gamma Ray Light
A. More than one million
B. One million
C. One
D. Fewer than one million
E. Five thousand
A. Land-based Unmanned System Integration
B. Large Scale Integration
C. Large UAV Integration
D. Substantial Scale Integration
E. Ultra Large Scale Integration
A. 1927
B. 1948
C. 1839
D. 1947
E. 1949
A. Sony
B. IBM
C. AT&T
D. Bell Labs
A. Semiconductor
B. Metal
C. Liquid
A. Server response time
B. The translation
C. Part of the translation
D. Performance data
E. Memory
A. Virtual Address Extension
B. Physical Address Extension
C. Address Resolution Protocol
D. Translation Table
E. Translation Lookaside Buffer
A. CISC
B. VLIW
C. Superscalar
A. Fewer than one
B. One
C. More than one
A. 1999
B. 2006
C. 2007
D. 1997
E. 2001
A. AMD
B. ARM
C. Intel
D. ARM Holdings
A. Shared Memory Pool
B. Serial Memory Page
C. Single Message Processing
D. Symmetric Multiprocessing
E. Supercomputing
A. A software application that helps manage large data sets
B. A computer architecture that allows multiple processors to share common memory
C. A computer architecture that allows multiple processors to share a single memory
D. A programming language that supports parallel processing
E. A computer architecture that provides fast performance
A. 64-bit
B. CPU
C. 32-bit
D. Graphics
E. 64-bit ARM
A. Jaguar
B. Bobcat
C. Rome
D. Sledgehammer
E. Bulldozer
A. A solar panel
B. A water pipe
C. A silicon wafer
D. A silicon ingot
E. A photoresist
A. Negative charge or positive charge
B. Metal or an insulator
C. Conductor or metal
D. Conductor or an insulator
E. Magnetism or an atom
A. Metal
B. Copper
C. Glass
D. Silicon Dioxide
A. A buffer against corrosion
B. A polar molecule
C. An insulating layer
D. A type of rock
E. A material used in lenses
A. TV antennas
B. Jewelry
C. Cigarette filters
D. Computer chips
E. Transistors
A. Making DVDs
B. Filling cavities in teeth
C. Holding food
D. Making computer chips
E. Making CDs
A. Computer
B. Processor
C. Integrated circuit
D. Memory chip
E. Transistor
A. Single Edge Connect
B. Dual Edge Connect
C. Quad Edge Connect
D. Double Edge Connect
A. The termination point of a cable
B. A data communications protocol
C. A telecommunications technology
D. A form of processor packaging
E. A computer networking standard
A. VLIW
B. RISC
C. CISC
A. A relatively limited number of instructions
B. A relatively high number of registers
C. A relatively large number of registers
D. A relatively large number of addressing modes
E. Multiplexed data and address buses
A. Reconfigurable Instruction Set Computer
B. Reduced Instruction Set Computer
C. Redundant Instruction Set Computer
A. Electronic component that resists the flow of current
B. Metal bar that provides a resistance to the flow of electric current
C. Device that smooths out the power supply to a device
D. Metal disk that resists the flow of heat
A. Wiring harness
B. Electronic component
C. Metal wire
D. Electrical load
E. Electrical wire