These Semiconductors multiple-choice questions and their answers will help you strengthen your grip on the subject of Semiconductors. You can prepare for an upcoming exam or job interview with these 100+ Semiconductors MCQs.
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A. Open current flow for in all directions
B. Block current in one direction while letting current flow in another direction.
C. Close current flow in all directions
A. Antimony
B. Phosphorus
C. Arsenic
D. Boron
A. Fermi-Dirac distribution
B. Maxwell-Boltzmann distribution
C. Bose-Einstein distribution
A. A p-n junction
B. An Early voltage
C. A metal-insulator-metal junction
D. A Hall effect junction
A. It has been melted and stirred.
B. Impurities have been added to make it less conductive.
C. Impurities have been added that alter its electronic properties in a controllable way.
D. It has had all of its impurities removed.
A. Changes a semiconductor's behavior
B. Duplicate the semiconductor
C. Oxygenate a semiconductor
D. Purifies a semiconductor
A. Yes. All semiconductors are found in sand quarries.
B. No. It needs impurities to become semi-conductive.
C. Yes.
D. Yes. The purer, the better.
A. N-Type & P-Type
B. Schottky & De Forest
C. Left-handed & Right-handed
D. Intrinsic & Extrinsic
A. cut off frequency
B. Matching Frequency
C. Resonant Frequency
D. Tunning Frequency
A. Miller's
B. Marleau's
C. Moore's
D. Marchand's
A. Source, gate, signal, and body.
B. Sand, gate, drain, and body.
C. Source, NOR, AND, and OR.
D. Source, gate, drain, and body.
A. To increase line focus
B. To improve breakdown voltage
C. To reduce step response time
D. To reduce the buildup of calcium carbonate
A. Resistive and conductive
B. Gamma and delta
C. Photon and phonon
D. Valence and conduction
A. Resistors
B. Electron
C. Diode
D. Transistor
A. Half a conductor.
B. A conductor that doesn't work very well.
C. The combination of a conductive material, and an insulator.
D. Two halves of a conductor.
A. N-n-n, and p-n-p.
B. N-p-r, u-p-n
C. n-p-n, and p-n-p.
D. n-p-n, and p-n-n-p.
A. PSET
B. MTT
C. NRT
D. BJT
A. They are not important.
B. They are large and durable.
C. They successfully replaced vacuum tubes as the primary way to compute data.
D. They replaced silicon.
A. Source, drain, and gate
B. Voltage, current, and resistivity
C. Emitter, collector, and base
D. Dopant, acceptor, and donor
A. Fabrication
B. Insertion
C. Photolithography
D. Doping
A. Melting.
B. Cracking.
C. Doping.
D. Conducting.
A. Bimetallic Jennings transistor
B. Back justified transistor
C. Boron joint transistor
D. Bipolar junction transistor
A. Salt.
B. Silicon.
C. Glass.
D. Rubber.
A. Light Emission Device
B. Light Electromagnetic Diode
C. Light Emitting Diode
D. Light Electron Device
A. Insulated gate bipolar transistor.
B. Intrinsic germanium-based transistor
C. Inert gate bidirectional transistor
D. Iodine graphite boron transistor
A. fermion
B. boson
A. A semiconductor made of three parts of one element to five parts of another element
B. A semiconductor made from elements in columns III and V of the periodic table
C. A semiconductor with conduction bands at 3 eV and 5 eV
A. An n-type semiconductor.
B. A boronic transistor.
C. A boric reaction transistor.
D. A p-type semiconductor.
A. Fermi-Dirac distribution & density of states
B. Ohm's law & Kirchhoff's current law
C. Riemann zeta function & Fourier transform
D. Bose-Einstein distribution & Bessel functions
A. Tunneling
B. Spontaneous emission
C. Initialization
D. Recombination
A. Drift, Diffusion, Recombination-Generation
B. Recombination-Generation, Dissension, Diffusion
C. Dissension, Drift, Recombination-Generation
D. Drift, Diffusion, Dissension
A. BJT
B. SCR
C. TRIAC
D. MOSFET
A. Their crystal lattice.
B. Their outside.
C. Their center.
D. Their layers.
A. A photon-phonon pair
B. An electron-hole pair
C. A magnetic monopole
D. A bandgap resonance
A. bandgap
B. phonon frequency
C. electron effective mass
D. permittivity
A. Potential
B. Energy
C. Conductivity
D. Power
A. Fermi energy
B. Dirac statistics
C. Fermi level
D. Fermion level
A. Photolithography
B. Chemical Vapor Deposition (CVD)
C. MEMS
D. Sputtering
A. semi-minor axis of the ellipse
B. major axis of the ellipse
C. major chord
D. minor axis of the ellipse
A. All of these are characteristics of a degenerate semiconductor
B. It conducts like a metal
C. Its Fermi level is nearly equal to its conduction or valence band energy
D. It is highly doped
A. Metal Transistors
B. Memory Thyristors
C. Metal Resistors
D. Memory resistors
A. L
B. Q
C. T
D. R
A. Transistors
B. Inductors
C. Diodes
D. Resistors
A. 17%
B. 33%
C. 52%
D. 21%
A. Copper, indium, gallium, selenium
B. Cadmium, indium, germanium, sulphur
C. Copper, indium, gallium, silver
D. Carbon, iodine, germanium, sulphur
A. 1.12 eV
B. 25.6 meV
C. 15 eV
D. 137 meV
A. Group IV
B. Group V
C. Group III
D. Group VI
A. Fab
B. Chip shop
C. Semiconductor production facility (SPF)
D. Platter plant
A. 1.12 eV
B. 1.41 eV
C. 2.83 eV
D. 0.79 eV
A. Germanium
B. Gallium arsenide
C. Silicon carbide
D. Silicon
A. They have been delocalized.
B. They have been sped up.
C. They have been bombarded.
D. They are encircled by neutrinos.
A. Silicon
B. Gallium arsenide
C. Germanium
D. Aluminum arsenide
A. Nickel-palladium crystal catalysis
B. Schottky crystalization
C. Czochralski process
D. Chemical vapor deposition
A. Scribe line
B. Adhesive
C. Hexode
D. Mask
A. Extrinsic
B. Intrinsic
C. Freeze Out
D. Melt In
A. nm^3
B. mm^3
C. m^3
D. cm^3
A. True
B. False
A. It liberates a large number of free majority carriers
B. None of these
C. It consists of electrical breakdown in a forward biased p-n diode
D. All of these
E. It occurs in heavily doped junctions
A. Accumulation
B. Conduction
C. Inversion
D. Depletion
A. Electron density
B. Magnetic Orientation
C. Thermal Motion
D. Synthetic Osmosis
A. A photon
B. A phonon
A. positively charged
B. negatively charged
C. electrically neutral
D. none of the above
According to the Barkhausen criterion for oscillators_______.
A – open loop gain
β – feed back factor
A.
Aβ < 1
B.
Aβ > 1
C.
Aβ = 1
D.
Aβ ≤ 1
A. increase
B. decrease
C. remain constant
A. 5.2 mA
B. 6.12 mA
C. 7.03 mA
D. 7.45 mA
A. 2IB
B. 10IB
C. 4IB
D. IB/2
A. 0.2
B. 200
C. 100
D. 20
A. positive half-cycle through the load
B. negative half-cycle through the load
C. both positive and negative half-cycles through the load
D. None of the above
A. 5v
B. 12v
C. 10.36v
D. 5.18v
A. from the cathode to the anode
B. from the anode to the cathode
C. in both the above directions
D. alternately in both directions
A. 40%
B. 30%
C. 22%
D. 27%
A. very slight
B. moderate
C. heavy
A. 20KHZ
B. 50KHZ
C. 100KHZ
D. 200KHZ
A. 30.4
B. 32.9
C. 57
D. 4.5
A. with the decrease in positive gate voltage
B. with the increase in positive gate voltage
C. with the decrease in negative gate voltage
D. with the increase in negative gate voltage
A. 130 dB
B. 140 dB
C. 132 dB
D. 138 dB
A. C/LR
B. R/LC
C. L/CR
D. 2L/CR
A. triode
B. pentode
C. thyratron
D. diode
A. Open
B. Short
C. Sometimes open and sometimes short
D. Unchanged
A. 40%
B. 81.2%
C. 90%
D. 99%
A. 5v
B. 10v
C. 20v
D. 30v
A. triangular
B. rectangular
C. saw-tooth
D. spiked
A. 0.95
B. 10
C. 9.5
D. 0.095
A. 300
B. 600
C. 900
D. 1800
A. rectangular
B. spiked
C. triangular
D. sinusoidal
A. 0.9v for si transistors
B. 0.5v for si transistors
C. 0.3v for si transistors
D. 0.7v for si transistors
A. fo = 1/2П√RC
B. fo = 1/2П√6RC
C. fo = 1/√2ПRC
D. fo = 2/√2ПRC
A. Ω
B. KΩ
C. MΩ
D. mΩ
A. 0
B. low
C. very high
D. very low
A. 2mA
B. 1mA
C. 4mA
D. 8mA
A. 10 mA
B. 20 mA
C. 5 mA
D. 3.18 mA
A. a rectifier and an amplifier
B. a rectifier and a transistor
C. a rectifier and an oscillator
D. a rectifier and an inverter
A. an RC oscillator
B. an LC oscillator
C. a Crystal oscillator
A. 4.7v
B. 5.4v
C. 3.3v
D. 0.7v
A. in phase
B. 90° out of phase
C. 180° out of phase
D. 120° out of phase
A. 0
B. positive
C. negative
A. bipolar device
B. tripolar device
C. unipolar device
A. only n-channel devices in the circuit
B. only p- channel devices in the circuit
C. both n and p channel devices in the circuit
D. None of the above
A. Np/Ns=40
B. Np/Ns=20
C. Np/Ns=30
D. Np/Ns=10
A. 0
B. 10
C. 1
D. 100